Model 656 Dimple Grinder

Rapid material removal with minimal damage

Dimple grinding offers a fast and reliable mechanical method of pre-thinning to near electron transparency (in some cases to electron transparency) greatly reducing ion milling times and uneven thinning.

Dimple grinding offers a means of producing quality TEM specimens having a large central area only a few microns thick surrounded by a robust outer rim. This eliminates special handling techniques for fragile specimens.

Dimple grinding and subsequent polishing with felt wheels provides an exceptionally smooth surface reducing the prospect of surface irregularities developing in the final ion beam thinning operation, increasing the yield of the electron transparent area.

A dual measuring system, digital micrometer and analog dial indicator, provides accurate depth and thickness control to within 1 micron.

Simple, easy operation with optimum performance.. Zero the digital reading by lowering the grinding wheel onto the specimen mount. Adjust the micrometer to set the desired final thickness on th digital display and begin dimpling.

A 40X microscope mounts over the specimen rotation table to precisely align a specific site with to the centerline of the grinding wheel. When used with the Pyrex specimen mounts the transmitted light shows the change of color relative to thickness for semiconductor materials.

To download a PDF with information on Dimpling Ductile Materials, click here

Specifications

Complimentary Instruments

1. 601 Ultrasonic Disc Cutter
2. 601.07000 TEM Specimen Cross-Section Kit
3. 623 Disc Grinder
4. 623.40000 Specimen Mounting Hot Plate

Warranty

One year