Intended uses of the Alto 2500 with DualBeam
FIB-SEM
The Alto 2500 Cryo-system has recently been
attached to a FEI DB235 DualBeam FIB-SEM at
Harvard's new Center for Imaging and Mesoscale
Structures. This powerful combination can
perform all the cryo applications that a regular
SEM can provide and also enables additional
applications with the FIB.
In general, when a sample is frozen and entered
onto the Alto stage, a fracture surface is
prepared by using the knife. Thus when the
fracture path occurs along features of interest,
then subsequent SEM imaging of that fracture-prepared
surface provides the necessary information.
However, when the fracture does not reveal
the feature of interest, then subsequent FIB
milling of that surface can expose additional
features for SEM imaging. Three categories
of applications are being investigated with
the cryo-FIB.
1. The largest category is biological applications,
cross-sectioning specimens ranging from bamboo
to E coli. In all applications, it is hoped
that by FIB sectioning it will be possible
to reveal smaller features than are typically
imaged by cryo-SEM.
2. It is desired to study the agglomeration
of particles within a colloid. Often such
particles are studied by drying; however,
the distribution of particles changes during
the drying process. By freezing the solution
and then sectioning with a FIB, the position
of particles as they truly exist within the
suspension is revealed. Repeated slicing and
imaging (using specialised software) will
provide a set of pictures to evaluate 3-dimensional
arrangements. Material systems range from
oil-based lubricants to spin-coating composite
films.
3. Many thin film devices are produced which
contain films that are "soft" (and/or
easily volatilized), such that exposure to
FIB sectioning destroys the layer. It is hoped
that "FIB-ing" at cryo temperatures
will enable FIB without damaging the specimen.
For more information on the ALTO™ 2500, click here.
For more information about the Center for Imaging and Mesoscale Structures,
click here.
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