Model 601.0700 Cross Sectioning Kit

Simplifies producing TEM specimen cross-sections

The ideal kit for preparing XTEM samples of semiconductor devices, thin films of various substrates and composites.

Quickly and easily prepare XTEM samples for TEM study of interfaces with greater consistency.

Used in conjunction with the Ultrasonic Cutter, rectangular areas of interest are cut from bulk material. These sections are coated with epoxy, stacked and cured under pressure to obtain a strong bond with minimum glue thickness (< 1µm).

A cylinder is cut from the stack, inserted into a brass tube for final sectioning and eventually dimpling prior to ion milling.