Model 601 Ultrasonic Disc Cutter

Rapid cutting of brittle materials

The original disc cutter for TEM applications, introduced for cutting 2.3mm and 3mm discs from brittle materials such as ceramics, semiconductors and minerals.

A variety of cutting tool sizes (0.1mm to 10mm) and shapes (circles, squares, rectangles, etc.) has expanded its use beyond microscopy applications (cut holes or cut shapes).

Cutting is achieved through a piezo crystal driven Titanium tool in conjunction with a water-based slurry of boron nitride.

The gentle action of the cutting tool combined with a constant tool load provided by the action of the pivoting platform reduces or eliminates stress and chipping around the cutout or the cut piece.

Sample thickness can range from 30µm to 5mm and the depth of cut is continually displayed on a dial indicator (10µm resolution).

A microscope and positioning table (Optional) can provide precise cutting at a specific point on the sample surface. A primary application is precision TEM specimen preparation of materials, i.e. Semiconductors.

Specifications

	Dimension and Utilities
	Overall Size	112mmW x 187mmD x 375mmH (4.5"W x 7.5"D x 15"H)
	Shipping Weight	10kg (19lbs)
	Power Requirements	Universal voltage input 100VAC - 240VAC, 50/60Hz
	Optional Hot Plate	Assists in mounting samples by providing the optimum temperature for the mounting wax polymer supplied by Gatan

	Complimentary Instruments
	601.07000	TEM Specimen Cross-Section Kit
	623	Disc Grinder
	623.40000	Specimen Mounting Hot Plate
	623.40000	Dimple Grinder

Warranty

One year