出版物

41 - 50 of 917 publications

Mechanical response of gasoline soot nanoparticles under compression: An in situ TEM study

Tribology International
2019

Jenei, I. Z.; Dassenoy, F.; Epicier, T.; Khajeh, A.; Martinic, A.; Uy, D.; Ghaednia, H.; Gangopadhyay, A.

Direct observation of the crystal structure changes in the MgxZn1 − xO alloy system

Thin Solid Films
2015

Yoo, S. J.; Lee, J. -H.; Kim, C. -Y.; Kim, J. -G.

Abnormalities associated with grain growth in solid solution Cu(Ni) thin films

Thin Solid Films
2014

Brons, J. G.; Thompson, G. B.

Effect of wavelength modulation of arc evaporated Ti–Al–N/Ti–Al–V–N multilayer coatings on microstructure and mechanical/tribological properties

Thin Solid Films
2014

Pfeiler-Deutschmann, M.; Mayrhofer, P. H.; Chladil, K.; Penoy, M.; Michotte, C.; Kathrein, M.; Mitterer, C.

The hardness and related deformation mechanisms in nanoscale crystalline–amorphous multilayers

Thin Solid Films
2015

Cui, Y.; Huang, P.; Wang, F.; Lu, T. J.; Xu, K. W.

Morphological and structural changes during the reduction and reoxidation of CuO/CeO2 and Ce1–xCuxO2 nanocatalysts: In situ studies with environmental TEM, XRD, and XAS

The Journal of Physical Chemistry
2011

Ciston, J.; Si, R.; Rodriguez, J. A.; Hanson, J. C.; Martinez-Arias, A.; Fernandez-Garcia, M.; Zhu, Y.

Structural dynamics of viral nanomachines

Technology
2014

Kam, J.; Demmert, A. C.; Tanner, J. R.; McDonald, S. M.; Kelly, D. F.

Investigation of dealloying by ultra-high-resolution nanotomography

Surface and Interface Analysis
2012

Hashimoto, T.; Curioni, M.; Zhou, X.; Mancuso, J.; Skeldon, P.; Thompson, G. E.

Revealing the three dimensional internal structure of aluminium alloys

Surface and Interface Analysis
2013

Thompson, G. E.; Hashimoto, T.; Zhong, X. L.; Curioni, M.; Zhou, X.; Skeldon, P.; Withers, P. J.; Carr, J. A.; Monteith, A. G.

Power-law characteristics of damage and failure of ceramic coating systems under three-point bending

Surface and Coatings Technology
2016

Liang, L. H.; Li, X. N.; Liu, H. Y.; Wang, Y. B.; Wei, Y. G.

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