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采用PIPS II系统进行FIB样品清洗的样品装调教程
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PIPS II的样品台及离子束调试
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采用PIPS II系统进行FIB样品清洗
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EM制样设备离子枪及冷阴极规的清洗
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Atomic level EELS prepared in PIPS II system following FIB preparation (image 2)
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Atomic level EELS prepared in PIPS II system following FIB preparation
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AlPb melt-spun ribbon with 1 - 3% at wt Ga HR-STEM using TEAM 0.5
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Ca3Co4O9 on SrTiO3 substrate
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Sample La23Sr13MnO3 + 30% ZrO2 on LaAlO3 substrate
Aitkaliyeva, A.; Madden, J. W.; Miller, B. D.; Cole, J. I.; Gan, J.
Thickness and defocus dependence of inter-atomic electric fields measured by scanning diffraction
Addiego, C.; Gao, W.; Pan, X.
Adikimenakis, A.; Chatzopoulou, P.; Dimitrakopulos, G. P.; Kehagias, Th.; Tsagaraki, K.; Androulidaki, M.; Doundoulakis, G.; Kuzmik, J.; Georgakilas, A.
Wang, G.; Wang, H.; Wen, J.
Kumar, A.; Nayak, S. K.; Bijalwan, P.; Dutta, M.; Banerjee, A.; Laha, T.
Olsen, V. S.; Bazioti, C.; Baldissera, G.; Azarov, A.; Prytz, Ø.; Persson, C.; Svensson, B. G.; Kuznetsov, A. Y.; Vines, L.
Continuous polycrystalline silicon layers on glass grown from tin solutions
Bansen, R.; Ehlers, C.; Teubner, T.; Markurt, T.; Schmidtbauer, J.; Boeck, T.
Wegele, T.; Beyer, A.; Ludewig, P.; Rosenow, P.; Duschek, L.; Jandieri, K.; Tonner, R.; Stolz, W.; Volz, K.
Assessment of residual stress fields at deformation twin tips and the surrounding environments
Abdolvand, H.; Wilkinson, A. J.
Wang, L.; Mostaed, E.; Cao, X.; Huang, G.; Fabrizi, A.; Bonollo, F.; Chi, C.; Vedani, M.
Yoo, J. H.; Yang, J. -M.
Yang, J.; Huang, J.; Fan, D.; Chen, S.
Tang, Y. L.; Zhu, Y. L.; Ma, X. L.
Evolution of annealing texture in cryo-rolled copper
Anand, G.; Barai, K.; Madhavan, R. Chattopadhyay, P. P.
Thermodynamic modelling of Al-UX (X= Si, Zr)
Rabin, D.; Shneck, R. Z.; Rafailov, G.; Dahan, I.; Meshi, L.; Brosh, E.
Local structure and thermoelectric properties of Mg 2 Si 0.977-x Ge x Bi 0.023
Farahi, N.; Prabhudev, S.; Botton, G. A.; Zhao, J.; Tse, J. S.; Liu, Z.; Salvador, J. R.; Kleink, H.
Microstructural evolution of nanometric Ti(NiCu)2 precipitates in annealed Ni–Ti–Cu thin films
Callisti, M.; Polcar, T.
The hardness and related deformation mechanisms in nanoscale crystalline–amorphous multilayers
Cui, Y.; Huang, P.; Wang, F.; Lu, T. J.; Xu, K. W.
Gandman, M.; Kauffmann, Y.; Kaplan, W. D.
Antou, G.; Guyot, P.; Pradeilles, N.; Vandenhende, M.; Maître, A.
Bachmaier, A.; Aboulfadl, H.; Pfaff, M.; Mücklich, F.; Motz, C.
Pawar, S.; Zhou, X.; Hashimoto, T.; Thompson, G. E.; Scamans, G.; Fan, Z.
Zhou, D.; Sigle, W.; Okunishi, E.; Wang, Y.; Kelsch, M.; Habermeier, H. -U.; van Aken, P. A.
Galstyan, E.; Gharacheshmeh, H. M.; Delgado, L.; Xu, A.; Majkic, G.; Selvamanickam, V.
Automated CBED processing: Sample thickness estimation based on analysis of zone-axis CBED pattern
Klinger, M.; Němec, M.; Polívka, L.; Gärtnerová, V.; Jäger, A.
Eftink, B. P.; Mara, N. A.; Kingstedt, O. T.; Safarik, D. J.; Lambros, J.; Robertson, I. M.
Li, X.; Ge, B.; Li, F.; Luo, H.; Wen, H.
Pfeiler-Deutschmann, M.; Mayrhofer, P. H.; Chladil, K.; Penoy, M.; Michotte, C.; Kathrein, M.; Mitterer, C.
Pavlov, D. A.; Bobrov, A. I.; Novikov, A. V.; Sorokin, D. S.; Malekhonova, N. V.; Pirogov, A. V.; Nikolitchev, D. E.; Boryakov, A. V.
Hospodková, A.; Pangrác, J.; Vyskočil, J.; Zíková, M.; Oswald, J.; Komninou, P.; Hulicius, E.
Physical properties of hot wall deposited Sn1-XPbXS thin films
Gremenok, V. F.; Ivanov, V. A.; Izadneshan, H.; Lazenka, V. V.; Bakouie, A.
Wang, M. J.; Yang, H.; Zhang, Q. L.; Lin, Z. S.; Zhang, Z. S.; Yu, D.; Hu, L.
Evidence of dislocation cross-slip in MAX phase deformed at high temperature
Guitton, A.; Joulain, A.; Thilly, L.; Tromas, C.
Formation of amorphous phase with crystalline globules in Fe–Cu–Nb–B immiscible alloys
Nagase, T.; Suzuki, M.; Tanaka, T.
Ceramic-metallic (TiN-Cu) nanostructured ion-plasma vacuum-arc coatings for cutting hard-alloy tools
Blinkov, I. V.; Volkhonskii, A. O.; Laptev, A. I.; Sviridova, T. A.; Tabachkova, N. Yu.; Belov, D. S.; Ershova, A. V.
Benck, J. D.; Lee, S. C.; Fong, K. D.; Kibsgaard, J.; Sinclair, R.; Jaramillo, T. F.
Thorel, A.; Ciston, J.; Bartel, T.; Song. C. Y.; Dahmen, U.
Optimized Ar+-ion milling procedure for TEM cross-section sample preparation
Dieterle, L.;Butz, B.; Müller, E.
695 型
产品说明书
应用
使用 PIPS II 系统制备半导体器件的截面 TEM 样品
在 PIPS II 系统中对聚焦离子束样品进行氩离子抛光
准备，设置，开始！确保可重复的高质量 TEM 样品制备流程
广告
采用低能量宽离子束研磨技术提高 FIB 制备的 TEM 样品的质量
采用宽氩束抛光技术快速完成 FIB 制备的 TEM 薄样品的抛光
II-V MOSFET High-K 栅极中的界面进行原子解析 EELS 分析
方案
EM制样设备离子枪及冷阴极规的清洗
PIPS II的样品台及离子束调试
采用PIPS II系统进行FIB样品清洗的样品装调教程
采用PIPS II系统进行FIB样品清洗
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