Advantages:
- X,Y stage permits alignment of argon beams to region of interest on the sample
- Improved collimated beam provides useable voltages as low as 100 volts for rapid and damage free preparation of FIB lamella
- Digital optical imaging with image storage and analysis in DigitalMicrograph® software
- 10" color touch screen for display and control of all PIPS™ II parameters
Science Direct
2022
Virtual and Physical Prototyping
2022
Model 695
Datasheet
Precision Ion Polishing System (PIPS™) II
Applications
Poster
Application of low energy broad ion beam milling to improve the quality of FIB prepared TEM samples
Post FIB clean up of TEM lamella using broad argon beam polishing
Atomic resolved EELS analysis across interfaces in II-V MOSFET high-k dielectric gate stacks
Protocols
Cleaning guns and cold cathode gauge
Stage and beam alignment
Lamella alignment
Lamella recipe
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