- X,Y stage permits alignment of argon beams to region of interest on the sample
- Improved collimated beam provides useable voltages as low as 100 volts for rapid and damage free preparation of FIB lamella
- Digital optical imaging with image storage and analysis in DigitalMicrograph® software
- 10" color touch screen for display and control of all PIPS™ II parameters
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DuoPost Sample Insertion
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Mounting a Sample on a DuoPost
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Cleaning the guns and cold cathode gauge
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Lamella recipe for the PIPS II system
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Stage and beam alignment on the PIPS II system
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Lamella alignment on the PIPS II system
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Atomic level EELS prepared in PIPS II system following FIB preparation (image 2)
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Atomic level EELS prepared in PIPS II system following FIB preparation
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AlPb melt-spun ribbon with 1 - 3% at wt Ga HR-STEM using TEAM 0.5
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Ca3Co4O9 on SrTiO3 substrate
Aitkaliyeva, A.; Madden, J. W.; Miller, B. D.; Cole, J. I.; Gan, J.
Mg segregation at inclined facets of pyramidal inversion domains in GaN:Mg
Persson, A. R.; Papamichail, A.; Darakchieva, V.
Sun, J.; Ding, D.; Liu, W.; Wu, W.; Liu, H.; Wei, G.; Liu, H.
Xi, R.; Jiang, H.; Li, G.; Zhang, Z.; Zhao, G.; Vanmeensel, K.; Kustov, S.; Humbeeck. J. V.; Wang. X.
Wu, S.; Kou, Z.; Lai, Q.; Lan, S.; Katnagallu, S. S.; Hahn, H.; Taheriniya, S.; Wilde, G.; Gleiter, H.; Feng, T.
Xiao, B.; Luan, J.; Zhao, S.; Zhang, L.; Chen, S.; Zhao, Y.; Xu, L.; Liu, C. T.; Kai, J. -J.; Yang, T.
Elgvin, C.; Kjeldby, S. B.; Both, K. G.; Nguyen, P. D.; Prytz, Ø.
Leong, Z.; Huang, Y.; Wróbel, J. S.; Gao, J.; Morley, N.; Goodall, R.
Liu, F.; Hu, W. -X.; Yang, Z. -H.; Wang, W.; He, W.
Sui, Y. -D.; Jiang, Y. -H.; Wang, Q. -D.
Cai, Y.; Xiang, S.; Tan, Y.
Observation of ferroelastic and ferroelectric domains in AgNbO3 single crystal
Zhao, W.; Fu, Z.; Deng, J.; Li, S.; Han, Y.; Li, M. -R.; Wang, X.; Hong, J.;
Wu, Y.; Xiong, Y.; Liu, W.; Chen, Z.; Zhang, X.; Wang, S.; Cao, W.
Cao, B. X.; Kong, H. J.; Ding, Z. Y.; Wu, S. W.; Luan, J. H.; Jiao, Z. B.; Lu, J.; Liu, C. T.; Yang, T.
Liu, B.; Zhao, G.; Zhang, X.; Guo, J.; Gong, S.; Xie, G.; Peng, L.; Li, Z.
A novel lean alloy of biodegradable Mg–2Zn with nanograins
Wang, W.; Blawert, C.; Zan, R.; Sun, Y.; Peng, H.; Ni, J.; Han, P.; Suo, T.; Song, Y.; Zhang, S.; Zheludkevich, M. L.; Zhang, X.
Rymer, L. -M.; Winter, L.; Hockauf, K.; Lampke, T.
Observations of multi-component boride precipitates in ultrahard boron carbide
Karre, R.; Hua, Y.; Song, S.; Wang, X.; Joardar, J.; Reddy, K. M.
The microstructural and stress evolution in sputter deposited Ni thin films
Koenig, T. R.; Rao, Z.; Chason, E.; Tucker, G. J.; Thompson, G. B.
Chen, W.; Ding, D.; Zhang, W.; Xiao, D.
Thickness and defocus dependence of inter-atomic electric fields measured by scanning diffraction
Addiego, C.; Gao, W.; Pan, X.
Adikimenakis, A.; Chatzopoulou, P.; Dimitrakopulos, G. P.; Kehagias, Th.; Tsagaraki, K.; Androulidaki, M.; Doundoulakis, G.; Kuzmik, J.; Georgakilas, A.
Wang, G.; Wang, H.; Wen, J.
Kumar, A.; Nayak, S. K.; Bijalwan, P.; Dutta, M.; Banerjee, A.; Laha, T.
Olsen, V. S.; Bazioti, C.; Baldissera, G.; Azarov, A.; Prytz, Ø.; Persson, C.; Svensson, B. G.; Kuznetsov, A. Y.; Vines, L.
Continuous polycrystalline silicon layers on glass grown from tin solutions
Bansen, R.; Ehlers, C.; Teubner, T.; Markurt, T.; Schmidtbauer, J.; Boeck, T.
Wegele, T.; Beyer, A.; Ludewig, P.; Rosenow, P.; Duschek, L.; Jandieri, K.; Tonner, R.; Stolz, W.; Volz, K.
Assessment of residual stress fields at deformation twin tips and the surrounding environments
Abdolvand, H.; Wilkinson, A. J.
Wang, L.; Mostaed, E.; Cao, X.; Huang, G.; Fabrizi, A.; Bonollo, F.; Chi, C.; Vedani, M.
Yoo, J. H.; Yang, J. -M.
Yang, J.; Huang, J.; Fan, D.; Chen, S.
Tang, Y. L.; Zhu, Y. L.; Ma, X. L.
Evolution of annealing texture in cryo-rolled copper
Anand, G.; Barai, K.; Madhavan, R. Chattopadhyay, P. P.
Thermodynamic modelling of Al-UX (X= Si, Zr)
Rabin, D.; Shneck, R. Z.; Rafailov, G.; Dahan, I.; Meshi, L.; Brosh, E.
Local structure and thermoelectric properties of Mg 2 Si 0.977-x Ge x Bi 0.023
Farahi, N.; Prabhudev, S.; Botton, G. A.; Zhao, J.; Tse, J. S.; Liu, Z.; Salvador, J. R.; Kleink, H.
Microstructural evolution of nanometric Ti(NiCu)2 precipitates in annealed Ni–Ti–Cu thin films
Callisti, M.; Polcar, T.
The hardness and related deformation mechanisms in nanoscale crystalline–amorphous multilayers
Cui, Y.; Huang, P.; Wang, F.; Lu, T. J.; Xu, K. W.
Gandman, M.; Kauffmann, Y.; Kaplan, W. D.
Antou, G.; Guyot, P.; Pradeilles, N.; Vandenhende, M.; Maître, A.
Bachmaier, A.; Aboulfadl, H.; Pfaff, M.; Mücklich, F.; Motz, C.
Pawar, S.; Zhou, X.; Hashimoto, T.; Thompson, G. E.; Scamans, G.; Fan, Z.
Zhou, D.; Sigle, W.; Okunishi, E.; Wang, Y.; Kelsch, M.; Habermeier, H. -U.; van Aken, P. A.
Galstyan, E.; Gharacheshmeh, H. M.; Delgado, L.; Xu, A.; Majkic, G.; Selvamanickam, V.
Automated CBED processing: Sample thickness estimation based on analysis of zone-axis CBED pattern
Klinger, M.; Němec, M.; Polívka, L.; Gärtnerová, V.; Jäger, A.
Eftink, B. P.; Mara, N. A.; Kingstedt, O. T.; Safarik, D. J.; Lambros, J.; Robertson, I. M.
Li, X.; Ge, B.; Li, F.; Luo, H.; Wen, H.
Pfeiler-Deutschmann, M.; Mayrhofer, P. H.; Chladil, K.; Penoy, M.; Michotte, C.; Kathrein, M.; Mitterer, C.
Pavlov, D. A.; Bobrov, A. I.; Novikov, A. V.; Sorokin, D. S.; Malekhonova, N. V.; Pirogov, A. V.; Nikolitchev, D. E.; Boryakov, A. V.
Hospodková, A.; Pangrác, J.; Vyskočil, J.; Zíková, M.; Oswald, J.; Komninou, P.; Hulicius, E.
Physical properties of hot wall deposited Sn1-XPbXS thin films
Gremenok, V. F.; Ivanov, V. A.; Izadneshan, H.; Lazenka, V. V.; Bakouie, A.
Wang, M. J.; Yang, H.; Zhang, Q. L.; Lin, Z. S.; Zhang, Z. S.; Yu, D.; Hu, L.
Evidence of dislocation cross-slip in MAX phase deformed at high temperature
Guitton, A.; Joulain, A.; Thilly, L.; Tromas, C.
Formation of amorphous phase with crystalline globules in Fe–Cu–Nb–B immiscible alloys
Nagase, T.; Suzuki, M.; Tanaka, T.
Ceramic-metallic (TiN-Cu) nanostructured ion-plasma vacuum-arc coatings for cutting hard-alloy tools
Blinkov, I. V.; Volkhonskii, A. O.; Laptev, A. I.; Sviridova, T. A.; Tabachkova, N. Yu.; Belov, D. S.; Ershova, A. V.
Benck, J. D.; Lee, S. C.; Fong, K. D.; Kibsgaard, J.; Sinclair, R.; Jaramillo, T. F.
Thorel, A.; Ciston, J.; Bartel, T.; Song. C. Y.; Dahmen, U.
Optimized Ar+-ion milling procedure for TEM cross-section sample preparation
Dieterle, L.;Butz, B.; Müller, E.
Model 695
Datasheet
Precision Ion Polishing System (PIPS™) II
Applications
Poster
Application of low energy broad ion beam milling to improve the quality of FIB prepared TEM samples
Post FIB clean up of TEM lamella using broad argon beam polishing
Atomic resolved EELS analysis across interfaces in II-V MOSFET high-k dielectric gate stacks
Protocols
Cleaning guns and cold cathode gauge
Stage and beam alignment
Lamella alignment
Lamella recipe
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