TEM Specimen Preparation
laser ablation system microPREP System

Enables fast, clean, and efficient preparation of samples for microstructure characterization and failure analysis.

PIPS II System PIPS II System

Precision ion polishing system for precise centering, control, and reproducibility of your milling process.

Dimple Grinder II Dimple Grinder II

Fast and reliable mechanical method of pre-thinning to near electron transparency to greatly reduce your ion milling times and uneven thinning.

Disc Punch System Disc Punch System

Preferred method for cutting transmission electron microscope (TEM) discs from metals, alloys, and all ductile materials.

Disc Grinder System Disc Grinder System

Pre-thin and polish your samples to reduce ion milling times and improve quality.

Ultrasonic Cutter Ultrasonic Cutter

Cut your brittle materials beyond the 3 mm transmission electron microscope (TEM) disc to accurately cut holes or unique shapes.

Cryoplunge 3 System Cryoplunge 3 System

Semi-automated plunge freezing instrument.

Solarus Advanced Plasma Cleaning System Solarus Advanced Plasma Cleaning System

Advanced plasma cleaning system for removal of hydrocarbon contamination on TEM and SEM samples.

Cross Section Kit Cross Section Kit

Ideal for preparing cross sectional transmission electron microscopy (XTEM) samples of semiconductor devices, thin films of various substrates, and composites.