
Identifying titanium hydride in a titanium alloy using EBSD and quantitative backscatter imaging
May 1, 2025

The PECS™ III is a broad-beam argon ion milling system designed to produce consistent, high‑quality surfaces across semiconductors, batteries, and advanced materials using a single, integrated workflow. It enables reliable surface preparation for complex, multi‑material samples while minimizing operator dependence and preparation-induced artifacts.
Produces uniform, low damage surfaces suitable for demanding analytical techniques across a wide range of materials.
Improves milling rates by 4.4x and enables preparation of larger areas for faster, more meaningful results.
Prepares large area cross-sections with ease, supporting semiconductor, battery, and multilayer systems.
Ensures predictable, repeatable outcomes independent of operator skill, reducing rework and preparation variability.
Delivers results using one preparation workflow, reducing handling steps and improving overall efficiency.
Deposits consistently thin coatings to protect sample surfaces and enable analysis of delicate and non-conductive materials.
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