
Electron ptychography for atomic-scale defect analysis in two-dimensional materials
April 1, 2026
Award winning, high resolution imaging tools help you to understand ultrastructure of biological and inorganic specimens.

There are a number of options and technologies available for digital imaging in transmission electron microscopy (TEM) applications today. Traditionally, high energy electrons could not be directly exposed to a sensor without excessively damaging the detector. As a consequence, conventional TEM cameras first expose the incoming electron beam to a scintillating film that converts the electrons into light (photons). These photons are then transferred to the sensor, either through a series of optical lenses or a coupled fiber optic plate. Finally, the light is collected by a sensor where the image is created pixel-by-pixel based on the amount of light detected at each position in the sensor.
There are four basic steps in TEM imaging to address incoming electrons:

There are only two steps in TEM imaging with direct detection:
One key difference between conventional and direct detection is a custom CMOS sensor that utilizes the only radiation-hard architecture that can tolerate direct exposure to high-energy particles. To add, extremely high-speed electronics for data transfer and processing enable low-dose counting and super-resolution capabilities. Combined, this allows frame rates (4k x 4k) of 400 frames per second (fps) to be processed in real-time to achieve optimal results.

Gatan uses proprietary phosphor scintillators to optimize signal conversion that enhances detector sensitivity (SENS) and resolution. When you select a scintillator, it is appropriate to know the performance trade-offs between SENS and resolution.
Various coupling (lens- and fiber-coupled) mechanisms are available to optimize signal transfer and meet cost or performance targets for a given detector.
Lens-coupled: Lens optics transmit light to the sensor, where it is converted into sensor electrons (signal)

Fiber-coupled: Scintillator creates photons that subsequently create sensor electrons; fiber directly transmits light to the sensor with high efficiency

Sensor type (CCD vs. CMOS) offers significant trade-offs for TEM camera performance as there are fundamental differences in architecture.
Complementary metal–oxide–semiconductor (CMOS): Charge immediately converts to voltage (read-out with digital output); supports high frame rates, low overall electronics noise
Both technologies possess inherent advantages, so the question arises about what unique performance characteristics arise from each choice. CCDs can have a 100% fill factor that captures all incoming light, whereas part of the CMOS sensor is occupied by transistors and metal wiring associated with each pixel. Historically, CCDs provided higher-quality images with low noise at affordable prices. Recent design advancements and processing techniques now advance CMOS sensor performance so it is a viable choice for some applications. Note that CCDs still maintain an advantage for binning in terms of signal-to-noise. However, CMOS chips can scale the number of read-out ports and achieve very high frame rates.

When a charge converts to voltage, you typically generate noise
It is very important to optimize read-out noise (higher voltages) and speed (multi-port and fast read times) for CCDs.
CMOS typically is seen as a fast sensor because you can run in rolling shutter mode verses the slow global shutter mode.

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