Cross Section Kit

Ideal for preparing cross sectional transmission electron microscopy (XTEM) samples of semiconductor devices, thin films of various substrates, and composites.

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  • Quickly and easily prepare XTEM samples for TEM study of interfaces with greater consistency
  • Used in conjunction with the ultrasonic cutter, cut rectangular areas of interest from bulk material to produce coated, stacked, and pressure-cured sections with minimum glue thickness (<1 µm)
  • Suitable for preparing cylinder sections for dimpling prior to ion milling



Model 601.07


Cross Section Kit

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