TEM Specimen Preparation
PIPS II System PIPS II System

Precision ion polishing system for precise centering, control, and reproducibility of your milling process.

Dimple Grinder II Dimple Grinder II

Fast and reliable mechanical method of pre-thinning to near electron transparency to greatly reduce your ion milling times and uneven thinning.

Solarus II System Solarus II Plasma Cleaner

The next-generation plasma tool to remove hydrocarbon contamination from TEM and SEM samples and holders.

Disc Punch Disc Punch

Preferred method for cutting transmission electron microscope (TEM) discs from metals, alloys, and all ductile materials.

Disc Grinder System Disc Grinder

Pre-thin and polish your samples to reduce ion milling times and improve quality.

Ultrasonic Cutter Ultrasonic Cutter

Cut your brittle materials beyond the 3 mm transmission electron microscope (TEM) disc to accurately cut holes or unique shapes.

Cross Section Kit Cross Section Kit

Ideal for preparing cross sectional transmission electron microscopy (XTEM) samples of semiconductor devices, thin films of various substrates, and composites.