Publications

Ionization and electron excitation of C60 in a carbon nanotube: A variable temperature/voltage transmission electron microscopic study

PNAS

2022

Liu, D.; Kowashi, S.; Nakamuro, T.; Lungerich, D.; Yamanouchi, K.; Harano, K.; Nakamura, E.

Graphene coating on silicon anodes enabled by thermal surface modification for high-energy lithium-ion batteries

MRS Bulletin

2022

Kim, S. C.; Huang, W.; Zhang, Z.; Wang, J.; Kim, Y.; Jeong, Y. K.; Oyakhire, S. T.; Yang, Y.; Cui, Y.

In situ architecture of human kinetochore-microtubule interface visualized by cryo-electron tomography

bioRxiv

2022

Zhao, W.; Jensen, G. J.

The giant Mimivirus 1.2 Mb genome is elegantly organized into a 30 nm helical protein shield

bioRxiv

2022

Villalta, A.; Schmitt, A.; Estrozi, L. F.; Quemin, E. R. J.; Alempic, J. -M.; Lartigue, A.; Pražák, V.; Belmudes, L.; Vasishtan, D.; Colmant, A. M. G.; Honoré, F. A.; Couté, Y.; Grünewald, K.; Abergel, C.

Co3O4-ZrO2 and Co3O4-Nb2O5 crystalline-amorphous composites for H2O2 activation via Fenton-like and electroprotic processes – Proof of concept

Catalysis Today

2022

Mozgawa, B.; Sobańska, K.; Grybo, J.; Pietrzy, P.

Cryogenic 4D-STEM analysis of an amorphous-crystalline polymer blend: combined nanocrystalline and amorphous phase mapping

iScience

2022

Donohue, J.; Zeltmann, S. E.; Bustillo, K. C.; Savitzky, B.; Jones, M. A.; Meyers, G.; Ophus, C.; Minor, A. M.

AAA+ protease-adaptor structures reveal altered conformations and ring specialization

bioRxiv

2022

Kim, S.; Fei, X.; Sauer, R. T.; Baker, T. A.

Disentangling multiple scattering with deep learning: application to strain mapping from electron diffraction patterns

arXiv

2022

Munshi, J.; Rakowski, A.; Savitzky, B. H.; Zeltmann, S. E.; Ciston, J.; Henderson, M.; Cholia, S.; Minor, A. M.; Chan, M. K. Y.; Ophus, C.

Impact of precipitated phases on the microstructure and mechanical properties of eutectic Sn58Bi alloy

Journal of Alloys and Compounds

2022

Wei, Y.; Zhao, X.; Liu, Z.; Tan, C.

Microstructure evolution and shear strength of the Cu/Au80Sn20/Cu solder joints with multiple reflow temperatures

Materials

2022

Chen, C.; Sun, M.; Cheng, Z.; Liang, Y.

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